الوصف

Our *0 years’ manufacturing experience, the use of Laser-direct Imaging,
laser drilling and contouring, high layer count lamination processing equipment,
pulse plating and other specialized equipment factory-wide enables  Ausay to
produce *0 layer and above rigid boards and rigid-flex circuits up to *0 layers.
Backplane thicknesses up to .**6 (7mm), aspect ratios up to *0:1, 2/2 line/space
and impedance controlled designs are produced daily.

Layers count: *- *0
Min Line width/spacing(mil): 2.5/2.5
Max Aspect Ratio: *2:1
Board thickness: 0.*3*7.0mm
Max Panel size: *3"x*5"
Material: FR*4,High Tg FR*4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco...)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.