14-layer HDI PCB with ENIG Surface Finishing

الوصف

• Material type: FR*4, CEM*1, CEM*3, aluminum clad, arlon, teflon, taconic, rogers, polyimide, kapton, DuPont
• Material thickness (in inches): 0.**2, 0.**0, 0.**3, 0.**5, 0.**0, 0.**7, 0.**1, 0.**0, 0.**5"
• Layer counts: 1 to *8
• Max. board size: *3.*0 x *5.*0 (**0 x **0mm)
• IPC class: II, III, 1
• Annular ring: 5 mil/side or greater (min. design)
• Finish plating: Solder (HASL), lead free solder (HASL), ENIG (electroless nickel immersion gold), OSP, immersion silver, immersion tin, immersion nickel, hard gold and others
• Copper weight: 0.**7oz
• Trace/space width: 3 mils or greater
• Drill clearance: 0.1mm (laser drilling)
• Plated slots: 0.**6 or greater
• Smallest hole (finished): 0.1mm or greater
• Gold fingers: 1 to 4 edge (*0 to *0 micron gold)
• SMD pitch: 0.****0.****0.**0
• Soldermask type: LPI glossy, LPI-matte, SR***0
• Soldermask colors: Green, red, blue, black, white, yellow
• Legend colors: White, yellow, black, red, blue
• CNC route point: Any
• Minimum route width: 0.**1
• Scoring: Straight lines, jump scoring, panel edge to edge, CNC*
• Body gold: Hard, immersion (up to *0 micron gold)
• Data file format: Gerber **4x with embedder aperture
• Fab. Drawing format, DXF, HPGL, DWG, PDF, Gerber
• E.T testing: Flying probe, single sided, 1 up plate, clampshell, net list
• Counter sink/counter bore: Availiable up to 0.**0 diameter
• Control impedence: Yes
• Blind vias/buried vias: Yes
• Peelable mask: Yes
• Carbon: Yes