Item

Manufacture Capability

Material

FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*1, Aluminium, Metal based/High Frenquency

Layer No.

***0

Finished Board thickness

0.2 mm*3.8mm(8 mil***0 mil)

Board Thickness Tolerance

±*0%

Cooper thickness

0.5 OZ**1OZ (*8 um***5 um)

Copper Plating Hole

****0 um

Impedance Control

±*0%

Warp&Twist

0.*0%

Peelable

0.**2"(0.3mm)*0.*2(0.5mm)

Images

Min Trace Width (a)

0.1mm (4 mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Solder Mask

Min Solder Mask Dam (a)

0.***5 mm (2.5mil)

Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.***7"(0.**8mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (*5 mil)

Hole Size Tol (+/-)

PTH:±0.**5mm;NPTH: ±0.*5mm

Hole Position Tol

±0.**5mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  **7um  Au:**5u''

OSP

0.**0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.**5mm, Punching: ±0.*5mm

Beveling

*0°*5°

Gold Finger angle

*5° *0° *5° *0°

Certificate 

ROHS,  ISO***1:***8,  SGS,  UL certificate