سعر فوب
أحصل على آخر سعر( Negotiable )
|10 Piece Minimum Order
بلد:
China
نموذج رقم:
JTD
سعر فوب:
( Negotiable )أحصل على آخر سعر
الموقع:
China
سعر الحد الأدنى للطلب:
-
الحد الأدني للطلب:
10 Piece
تفاصيل التغليف:
Each with vacuum bag, 20 pieces in a paper box and then packed in cartons
موعد التسليم:
10-30 days after order
القدرة على التوريد:
500 Piece per Week
نوع الدفع:
T/T, L/C
مجموعة المنتج :
-
الشخص الذي يمكن الاتصال به Amanda
No.222 Weiqi Road Yueqing Economic Development Zone, Wenzhou, Zhejiang
Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for key materials of semiconductor packaging( molding compound, solder ball, high-desity packaging substrate, conducting resin).
Features of products:
1. material costs: low
2. electronical conductivity: 5.*8 *0E7/Ohm
3. thermal conductivity: *9.5KW/m2k
4. mechanical properties: good
5. stability: stable
6. solder joint: relatively better
Diameter(mm)
0.**8 | 0.**0 | 0.**3 | 0.**5 | 0.**8 | 0.**0 | 0.**2 | 0.**3 | 0.**8 | 0.**0 |
special order avaliable
Copper Wire Physical Properties:
Resistivity |
1.**0**0*6 Ω.cm |
Density |
8.9g/cm3 |
Purity |
5N |
Pull(Φ*5μm) |
>7cN |
Arc height |
8mil |
Fusing current |
Same as usual copper bonding wire |
Copper Bonding Wire Advantage:
1. Material costs: Low
2. Conductivity: 5.*8 *0 E7/Ohm Much thinner bonding wires during fine pitch packaging,
excellent performance of fine pitch(much smaller bonding pad), improving
current capacity and property of power regulating device.
3. Thermal conductivity: *9.5 KW/m2K
4. Mechanical properties: High mechanical property, larger tensile strength, better elongation,
excellent ball collar strength and higher arc stability.
5. Stability: Stable-slow inter metallic growth rate, improving mechanical stability
and decreasing incremental resistance: moderate IMC growth enables
bonding strength to be improved.
6. Solder joint: Significantly reduced inter-metallic growth rate of solder joints. Resistance
reduced, heat production decreased, bonding reliability and device performance
improved. As the new products have their inter-metallic growth rate, resistance
and heat production lower than gold wire, the amount of resistance increase with
time and aging rete also is reduced.
بلد: | China |
نموذج رقم: | JTD |
سعر فوب: | ( Negotiable ) أحصل على آخر سعر |
الموقع: | China |
سعر الحد الأدنى للطلب: | - |
الحد الأدني للطلب: | 10 Piece |
تفاصيل التغليف: | Each with vacuum bag, 20 pieces in a paper box and then packed in cartons |
موعد التسليم: | 10-30 days after order |
القدرة على التوريد: | 500 Piece per Week |
نوع الدفع: | T/T, L/C |
مجموعة المنتج : | - |