الوصف

PRODUCT DESCRIPTION

 

Rigid-flexible PCB material introduction





Mixed materials including RF and high speed, standard FR*4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.

 

Processing capability

 â— Layer count: 6 (rigid ) / 2 (flex)

 â— Copper Foil: 1/3oz to 2oz

 â— Min Line width/spacing : 3.0/3.0mil

 â— Drill to conductor: 8mil

 â— Surface Finishing: ENIG, Immersion Tin, Immersion Silver, Organic coating processing,etc

 

Quality control

 KingCredie follow the international standard manufacturing

 â— IPC-A***0G Printed board Acceptance Criteria

 â— IPC/CPCA****3B Flex boards Performance specification

 â— IPC-TM***0 Printed board experiment method