الوصف

Layer: 1 to *2 layers
Material: FR*4, CEM*1, CEM*3, Hight TG, FR4 halogen free, FR*1, FR*2
Max. finished thickness: 0.4 to 4.0mm
Max. finished board side: **0 x **0mm
Min. drilled hole size: 0.*5mm (*0mil)
Min. line width: 0.*0mm (4mil)
Min. line spacing: 0.*0mm (4mil)
Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold
Copper thickness: 0.5 to 3.0 oz
Solder mask color: green/black/white/red/blue
Inner packing: plastic bag
Outer packing: standard carton packing
Hole tolerance: PTH: ±0.**6, NTPH: ±0.*5
Certificate: UL, ISO ***1, ISO ****1, RoHS,   H.S CODE: *********0
Profiling punching: routing, V-cut, beveling
Providing OEM service to all sorts of printed circuit board assembly