BERGQUIST BP100 BOND-PLY TBP 850 BOND-PLY 100

الوصف

• BERGQUIST BP**8 BOND-PLY **0 BOND-PLY TBP **0   

  BERGQUIST BOND-PLY **0 Configurations Available:

  • Sheet form, roll form and die-cut parts

  Shelf Life: The double-sided, pressure sensitive adhesive used in BOND-PLY products

  requires the use of dual liners to protect the surfaces from contaminants. Henkel

  recommends a *-month shelf life at a maximum continuous storage temperature of

  *5°C or *-month shelf life at a maximum continuous storage temperature of *5°C, for

  maintenance of controlled adhesion to the liner. The shelf life of the BOND-PLY material,

  without consideration of liner adhesion (which is often not critical for manual assembly

  processing), is recommended at *2 months from date of manufacture at a maximum

  continuous storage temperature of *0°C.

   

  BERGQUIST BP**0  Typical Applications Include:

  • Mount heat sink onto BGA graphic

  processor or drive processor

  • Mount heat spreader onto power

  converter PCB or onto motor control PCB