الوصف

name: Mobile Phone Board Layers: 6L HDI Thickness: 1.0mm Inner Min line width / distance: 0.1mm/0.1mm Outer Min line width / distance: 0.*8mm/0.1mm Minimum laser hole: 0.1mm Minimum hole diameter: 0.2mm Impedance: *0 ohms, plus or minus *0% tolerance Fork points Impedance: **0 ohms, plus or minus *0% tolerance Minimum BGA solder joints: 0.*3mm Surface treatment: OSP + Immersion Gold Being Technology provides all range of services dealing with PCB Designing, Engineering, Manufacturing and PCB assembly, and our Logistics skills support us to meet the most requirements and to deliver worldwide on time, on price. We also provide small to large production volumes, with both short run and weekly production capabilities.