Continuous Magnetron Sputtering System

الوصف

A. System description:

This system is a dual chamber vertical box type structure three gumming multi-function in high vacuum magnetron sputtering coating equipment. This system for the continuous large flat-panel display coating pilot equipment, special on the flat glass production of multilayer metal film and ITO film and insulating film and ion cleaning before coating and the coating after eliminating stress annealing for completion. It is mainly composed of vacuum system, pressure control system, pneumatic system, electrical system, rectangular sputtering target (including twin sputtering target) and sputtering power supply, cooling system, sample system, heating and annealing samples ion cleaning system, plate transfer system, automatic control and alarm protection system, etc. Vertical structure can avoid target surface and the surface layer of membrane pollution caused by fall into the impurities and impurities target caused by short circuit, which can guarantee the purity of the membrane layer, and can guarantee the stability of equipment normal work and the safety of operating personnel.

This system includes sputtering chamber and into the sample chamber (room) and annealing.

        

Technical indicators:

1. Vertical box type double chamber structure: measures about L***0 * H**0MM W**0 stainless steel material (including sample/annealing chamber, sputtering chamber; the middle for the load lock isolation), indoor lighting and pneumatic manipulator and reciprocating motion system;

2. The sputtering materials: metal, ITO film, insulation film, etc

3. The three sets of ***0 l/s compound molecular pump vacuum system; And a set of MKS pressure control system of the United States.

Limiting vacuum sputtering chamber: 8 x ***5 pa sample limiting vacuum chamber: 2 x ***4 pa;

Abstract: 4. The extraction rate from atmospheric pressure to *0 Pa within the time for 5 minutes, using molecular pumped into *0 e - 4 Pa takes *0 minutes. Step-up ratio: stop after the chamber and the high vacuum, pressure rise is not more than *0 pa *2 hours later

5. Sample size: no more than L**0mm x W**0mm

6. Two rectangular target (the size of target is: delta W**0 L**0 * * 8 mm) and the twin sputtering target (target material for: delta W*0 L**0 * * 8 mm), RF/DC/intermediate frequency each one bipolar pulse sputtering power; Samples and the spacing between the target material: ****0 - mm is adjustable

7. Coating non-uniformity, plus or minus 5% or less; Coating repeatability: better than + / - 5%; The plating film adhesion test (using adhesive tape)

8. The maximum deposition rate: **0 or more A/min (Cr, Al, Cu)

9. Sputtering chamber pressure the MKS automatic pressure control instrument control: Pa 0.1 ~ 5 Pa (plus or minus 5% accuracy), a set of;

*0. Four road intake and MFC control argon, hydrogen (**0 SCCM); Oxygen, nitrogen (each **0 SCCM), and form a complete set of well gas and cut-off valve control; Process parameters can be computer control and storage;

*1. Samples of heating and annealing temperature: heating plate (at room temperature to **0 + 2 ); Annealing (at room temperature to **0 plus or minus 2 )

Annealing temperature uniformity: samples within the scope of temperature difference is less than + / - 5 

Substrate heating system with the samples

*2. The samples can be to online plasma cleaning

*3. The automatic control system adopts industrial computer and PLC control, touching screen operation, can choose automatic and manual mode. Implementation process and equipment operation stability control, high stability and repeatability.