Available Sizes
(Customized sizes are accepted)

*7.3〞X *9〞(***6mmX***9mm)

*7.3〞X *9.3〞(**7mmX***2mm)

*0〞X *8〞(***6mmX***9mm)

*1〞X *9〞(***1mmX***5mm)

*1.3〞X *9.3〞(***9mmX***2mm)

*2〞X *8〞(***7mmX***9mm)

*3〞X *9〞(***2mmX***5mm)

*3.3〞X *9.3〞(***0mmX***2mm)

*9〞X *9〞(***5mmX***5mm)

*9.3〞X *9.3〞(***2mmX***2mm)

Item

Manufacture Capability

Material

FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*3, Copper, Aluminum, etc.

Layer No.

***6

Finished Board thickness

0.2 mm*3.2mm

Board Thickness Tolerance

±*0%

Cooper thickness

0.5 OZ**1OZ (*8 um***5 um)

Copper Plating Hole

****0 um

Impedance Control

±*0%

Warp &Twist

0.*0%

Peelable

0.**2"(0.3mm)*0.*2’(0.5mm)

Min Trace Width (a)

0.1mm (4 mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (*5 mil)

Hole Size Tol (+/-)

PTH:±0.**5mm;NPTH: ±0.*5mm

Hole Position Tol

±0.**5mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel **7um Au:**5u''

OSP

0.**0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.**5mm, Punching: ±0.*5mm

Beveling

*0°*5°

Gold Finger angle

*5° *0° *5° *0°