copper clad laminates

الوصف

pengzhoudzdavid(at)sina.com CEM*1 Composite material composed of woven glass fabric surfaces and paper core combined with epoxy resin. Primarily used in the printed circuit board industry. Easy punching and excellent electrical properties and higher flexural strength than paper based grades. CEM*1 provides excellent mechanical and electrical properties, and punches well up to .**3″.

CEM*3  is very similar to FR4. Instead of woven glass fabric a flies type is used. CEM*3 has a milky white color and is very smooth. It is a complete replacement for FR4 and has a very large market share in Asia. It is a kind of flame retardant epoxy copper-clad plate glass material, is generally used in electronics with double sided and multilayer pcb boards. And CEM 3 is a new printed circuit substrate material developed based on FR 4. In recent years, CEM*3 is used to replace FR*4 in Japan, even more than the FR 4 dosage.