الوصف

Benefits

• Allows testing of RF devices at the wafer-level

• Adaptable to wafer-level probing and singulated device testing for debug and characterization

• Long life and extended maintenance intervals

• Engineering analysis of WLCSP devices or KGD

• Consistently high test yields

• Maximum mechanical operating window to overcome z-stack non-coplanarity

Key Features

• Low loop inductance and high bandwidth

• Device pitches down to **0 µm

• Variety of contact and body materials to optimize performance

• Manual actuation of singulated devices • Low and stable contact resistance

• Individual probe compliance with large mechanical overdrive