electronic PCB circuit maker of Shenzhen

Item

Specification

1.Base material

FR*4/ceramic/teflon/aluminum base

2.Finish board thickness

0.2mm*4.5mm

Tolerance: +/*0.*5mm

3.layer

***2 layers

4.Inner thickness

0.*5mm*2.5mm

Tolerance:+/*0.*8mm

5.Max.Panel Size

**0mm***0mm

6.Min.Hole size

0.2mm/8mil

Mechanical hole: 0.*5mm

Laser hole: 0.1mm

7.Min.Line width

0.1mm(4mil)

8.Min.Line spacing

0.1mm(4mil)

9.Hole tolerance

PTH: +/*3mil

NPTH: +/*2mil

*1.Min.welding ring

 4 mil

*0.surface treatment

OSP/HASL/immersion Tin/spray tin 

Immersion Ag /immersion Au/ENIG/

*2.Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

*3.E-testing pass percent

*7%pass for the first time,+/*2%(tolerance)

FQC-Physical Lab: Reliability tests

*4.Solder mask bridge

0.*5mm(6mil)

*5.copper thickness

***2 OZ  (****5um)

*6.Controlled Impedance

+/*5%

*7.Output

****0 square meters per month

*8.Delivery

**8 days

*9.Aspect Ratio

*5:1

*0.Warpage

 Board thickness≤0.*9mm: β≤1.0%

 0.*0≤Board thickness≤2.4mm: β≤0.7%

 Board thickness≥2.5mm: β≤0.5%

*1.Plugging vias capability

0.**0.8mm

*2.Certificate 

UL,ROHS,SGS,ISO***1:***8