Electroplated Diamond Wire for Sapphire Wafering

الوصف

We are the first and professional diamond wire manufacturer in the field of hard brittle materials cutting in China. 

Our Electroplated Diamond Wires are used to cut Sapphire, Silicon, CaF2, optical crystal, glass, Ge, GaAs, SiC, magnetic materials, ceramics, W alloy and many other hard and brittle materials in the field of PV, LED, semiconductor, optics and so on. We manufacture Diamond Wires diameter size from 0.*2mm to 0.*2mm, also can make according to customer's requirement.

Compared with steel wire, inner diamond saw and band saw cutting, the electroplated diamond wire cutting have many advantages: 1) Faster cutting than steel wire; 2) Friendly Environment and Economical production: No slurry, only city water or water-based coolant; Diamond wire cut repeatedly; 3) High production capacity; 4) Minimum kerfloss; 5) Lower roughness; 6) Better wafer quality. 

DIAT diamond wire can help you enhance production efficiency, save materials and reduce cost.