الوصف

FR4 PCB

Manufacturer's production capability:
 

• Item:
  • Material: FR*4/Hi Tg FR*4/lead-free materials (RoHS Directive-compliant)/CEM*3, aluminum, copper, metal based
  • Layer number: ***6
  • Finished board thickness: 0.**3.5mm (****8mil)
  • Board thickness tolerance: ±*0%
  • Cooper thickness: 0.**4oz (*****4um)
  • Copper plating hole: ****0um
  • Impedance control: ±*0%
  • Warp and twist: 0.*0%
• Image:
  • Minimum trace width (a): 0.**5mm (3mil)
  • Minimum space width (b): 0.**5mm (3mil)
  • SMD pitch (a): 0.2mm (8mil)
  • BGA pitch (b): 0.2mm (8mil)
• Solder mask:
  • Minimum solder mask dam (a): 0.***5mm (2.5mil)
  • Solder mask clearance (b): 0.**5mm (3mil)
  • Minimum SMT pad spacing (c): 0.**5mm (3mil)
  • Solder mask thickness: 0.***7" (0.**8mm)
  • Colors: green, white, red, yellow, black and more
• Holes:
  • Minimum hole size (CNC): 0.2mm (8mil)
  • Minimum punch hole size: 0.9mm (*5mil)
  • Hole size tolerance (+/-): PTH: ±0.**5mmï¼›NPTH: ±0.*5mm
  • Hole position tolerance: ±0.**5mm
• Plating:
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: **7um, Au: **5u''
  • OSP: 0.**0.5um
• V-cut angle:
  • *5°, *0°, *5°, *0°
• Certificates:
  • RoHS
  • ISO***1:***8
  • SGS
  • UL certificates