Hot sales semi automatic bga rework station DH-A2E

الوصف

â…  .Features:
1.Optical alignment which makes a chip accurately aligned,exactly avoid misplacement even shifting;
2.Automatically remove,pick up and solder,etc. Which can be exactly instead of a veteran;
3.No damage to devices during desoldering and soldering (including damage of appearance and function);
4.The desoldering and soldering process does not affect the periphery and back of the chip;
5.For the preheating temperature, the luminous heating tube is used. The temperature increased is fast and
the constant temperature is stable, and the PCBA desoldered and soldered does not change color or deform;
6.External temperature measurement interface, convenient to detect the temperature at any time, the tem-
perature control is more accurate and reliable;
7.Touch screen operation, the program is preset in advance, without professional technical training can be
skilled in use, so that the chip disassembled and welded becomes very simple
8.Manual and automatic operation of the two modes, debugging or batch-repair are more convenient and
simple;
9.External usb interface for software updates and import of various repair data into computer analysis and
storage;
*0. Disassembling and welding of lead-free or lead products are applicable;
*1.Suitable for multiple patch device repair (POP, SOP, SOJ, qfq, QFN, BGA, PLCC, SCP ... );

II. Product parameter
Power supply: AC**0V±*0% *0/*0Hz
Total Power: ***0W Upper heater: ***0W Bottom heater:2nd heating area/ ***0W，3rd heating area/***0W（expanded preheating square for bigger motherboards）
Dimensions: L**0×W**0×H**0 mm
Repair product range:
Repair BGA, QFN, BFP, LED lamp-beads (tape or in bulk),special and refractory components including CGA, BHA,QEN, CSP, LGA, microSMD, MLF(microleadfeames)
Operation mode：Automatic and manual modes been optional, HD touchscreen, intelligent                                      man-machine dialogue, digitizedation system Settings
Chip feeding： With a robot hand to automatically take or put, and feed or pick.
Profile Storage： **0,**0.*0 groups
CCD Camera： optical
Alignment：Auto-stretch to open / Auto-fold for storage
Camera pixel： 2 millions, industrial-level
Resolution ratio： ***0x***0, HD ***0p, FHD support
PCBA Positioning：Up and down intelligent positioning, the bottom "5 point support" with v-                                    type card slot fixing PCBA which can befreely adjusted in X-axis direction,                                     with external universal fixtures
BGA position： Laser positioning v-shaped card slot and universal fixtures
Temperature control： K Sensor,Closed loop.*-channel temperature controlsystem, PID                                                      automatic regulation
Temp accuracy ：±1℃
Position accuracy： ±0.*1mm
PCB size： Max **0×**0 mm Min *2×*2 mm
Minimum chip spacing： 0.1mm
Safety monitoring： Full-process automatic monitoring, automatic control,automatic                                                   correction,  automatic alarm hint
External Temperature Sensor： 1 pcs，(optional）
Net weight： *0kg