HT6700-W

الوصف

Place of Origin: Liaoning, China (Mainland) Brand Name: - Model Number: -
Number of Layers: *-Layer Base Material: FR*4 Copper Thickness: *6um
Board Thickness: 3.2mm Min. Hole Size: 0.2mm Min. Line Width: 0.*5mm
Min. Line Spacing: 0.*5mm Surface Finishing: HASL Lead free Gold thickness: 0.*5um
Ni thickness: 5um Copper(PTH): *1.5um Hole Roughness: *2.*5um
Solder Mask thickness: *6um Warp and Twist: 0.*3%
Item PR S-PR Sample
Min width / spacing **0/**0um *5/*5um *0/*5um                                                              
Outer copper thickness 1/**8Oz(*****0um) 1/***2Oz(*****0um) 1/***2Oz(*****0um)
Inner copper thickness 1/**5Oz(*****5um) 1/**6Oz(*****0um) 1/**8Oz(*****0um)
Core thickness ≥0.*6mm ≥0.*5mm ≥0.*5mm
Min Hole Mechanical drilling 0.*5mm 0.*0mm 0.*0mm
Laser drilling 0.*0mm 0.*7mm 0.*7mm
Min Hole spacing PTH 0.*0mm 0.*5mm 0.**5mm
NPTH 0.*5mm 0.*0mm 0.*0mm
Max panel size ***0mm X **0mm ***0mm X **0mm ***0mm X **0mm
Layer *8 Layer *4 Layer *8 Layer
Thickness 0.3 - 3.2mm 0.2 - 5.0mm 0.1 - 6.0mm
Thickness Tolerance ±*0% ±0.1mm ±0.1mm
Asperture ratio PTH *5:1(φ0.2mm/t=3.0mm) *7:1 *0:1
NPTH 8:1 6:1 4:1
Diameter tolerance PTH ±0.*8mm ±0.*5mm ±0.*5mm
NPTH ±0.*5mm ±0.*5mm ±0.*5mm
Material FR*1,CEM*1,CEM*3,*2F,Metal base/Ceramic base
FR*4(Tg≤**0,Halogen Free,High Frequency)
RCC,BT,PTFE,Teflon
Characteristic impedance ±*0% ±7% ±5%
Surface Technology OSP,HASL(Pb Free),ENIG,Immersion Tin/Silver
Nickel plating,Flash gold,Gold-Finger,Carbon,Silver Grout
ENIG Gold thick 0.*3 - 0.1um 0.*3 - 0.*5um 0.*3 - 0.2um
Nickel thick 2.5 - 5um 2.5 - 8um 2.5 - 8um
Flash gold Gold thick 0.*5 - 3um 0.*5 - 3um 0.*5 - 3um
Nickel thick 2.5 - *0um 2.5 - *0um 2.5 - *0um
HASL Tin-Lead thick 0.5 - *0um(SMD≤1/5)
Immersion Tin/Silver 0.8 *1.2um 1.0 *1.2um 1.0 *1.2um
Solder resist ink Processing methods:Screen printing,Electrostatic spraying
Color:Green, blue, black, red, yellow, white, etc.
V-CUT Angle *0.,*5.,*0.
tolerance ±0.2mm ±0.*5mm ±0.1mm