Immersion gold double-side board

الوصف

Feature:

1) Layers: 1L**8L
2) Material: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free,
3) Board finished thickness: 0.2mm*7.0mm
4) Solder mask color: green/yellow/black/white/red/blue
5) Max. finished board size: *3 × *5 ( **0mm×**0mm )
6) Min. Line width: 3mil (0.**5mm)
   Min.Line spacing: 3mil (0.**5mm)
7) Min. drilled hole size: 3mil (0.**5mm)
8) Surface finish/treatment : HASL / HASL lead free, HAL, Chemical tin,

Chemical Gold,  mmersion Silver/Gold,OSP,Gold plating
9) Copper thickness: 0.**7.0 OZ
*0) Copper thickness in hole: >*5.0μm (>1mil)
*1) Inner packing: Vacuum packing / Plastic bag
      Outer packing: Standard carton packing
*2) Shape tolerance: ±0.*3
     Hole tolerance: PTH: ±0.**6   NPTH: ±0.*5
*3) Certificate: UL, ISO ***1, ISO ****1, SGS, RoHS
*4) Special requirements: Buried and blind vias+controlled

impedance+BGA
*5) Profiling: Punching, Routing, V-CUT, Beveling
*6) Provides OEM services to all sorts of printed circuit board assembly

as well as electronic encased products