الوصف

• Technical parameters:
  • Surface treatment: HASL (LF), immersion gold, flash gold, OSP, immersion tin, immersion silver, HASL, gold finger and selective nickel
  • Laminates: CEM*3, PTFE, FR*4 (high-TG), metal base (AL, CU) and rogers
  • Layers: *6 (maximum)
  • Board size: *0 x *8 inches (maximum)
  • Board thickness: 0.4 to 5.5mm
  • Maximum copper thickness:
    • Inner layer: 4oz
    • Outer layer: 5oz
  • Track width: 4 mils or 0.1mm (minimum)
  • Track space: 4 mils or 0.1mm (minimum)
  • Hole size: 8 mils or 0.2mm (minimum)
  • Laser hole size: 4 mils or 0.1mm (minimum)
  • PTH wall thickness: 0.*-mil or *0μm
  • PTH diameter tolerance: ±3 mils or±*6μm
  • NPTH diameter tolerance: ±2 mils or±*0μm
  • Aspect ratio: *0:1
  • Impedance control: ±*0%
  • Size: *0 x *0mm
• Specifications:
  • Base material: FR4
  • Layer count: four layers
  • Board thickness: 1.6mm
  • Copper thickness: 1oz
  • Surface finishing: HASL
  • Soldermask color: green
  • Size: **7.5 x **7.8mm/2up