IWD ultrasonic grinding machine for diamond dies

الوصف

~This Ultrasonic Grinder applies for rubbing and polishing diamond die and mono diamond die, the new technology is rapidly extend and use in the global.UPM***0 ultrasonic grinder is designed for repair and polish diamond and artificial diamond drawing die range from 0.3 to 8.0mm.The great improvement lies in: the rotated auto swing structure, generator adopts transistor so as to improve power output.

To improve ultrasonic transducer design. Direct wind cooling improves product environment.

Technical parameter

1. power:**0V *0±2Hz

2. working frequency range:*0KHz

3. consume power:≤**0W

4. transducer: piezoelectricity wafter, wind cool

5. adding pressure method: use fluid drive, weight to add pressure

6. working rotate speed: **3 turn/ min

7. working rotate speed: around *0 turn/ min

8. working angle: not smaller than **0, ADJUSTABLE.