Multilayer PCB

الوصف

Type: four-layer PCB   Number of layers: double-sided and multi-layered (up to *8 layers) With blue,green ang black  solder mask   Materials: Fr4Tg ≥**0°C'  Surface finishes: lead free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, Goldfinger plating, carbon ink printing, and peelable blue mask (peters 2,**4) Cooper thikness: 4oz above  Board thickness: 1.6mm   M inimum  hole size: 0.*5mm is available   Mininum line width: 0.1mm    Minimun line spacing: 0.1mm Technology: blind via, buried via, selective plating, and micro via (laser drill)   Surface: high temperature tolerance OSP (Cu***6A HT (x))  Used for telecommunication products.  ISO *****-,TS ****9:****- and UL- certified. All the products have reatched the standards of IPC, ROHS.