الوصف

XPC Paper Base Copper Clad Laminates;
Characteristics: This product has good heat resistance, leakage resistance, excellent dimensional stability, small warpage, can be punched at low temperature (****0 ℃).
Application: Widely used in electronic consumer products.
Nominal Size: *1' x *9 "
Nominal thickness: 0.4mm to 3.0mm

FR*1 Paper Base Copper Clad Laminates;
Characteristics: This product has good heat resistance, leakage resistance, excellent dimensional stability, small warpage, can be punched at low temperature (****0 ℃). The combustibility meets the requirements of UL*4V*0.
Application: Widely used in electronic consumer products.
Nominal Size: *1' x *9 "
Nominal thickness: 0.4mm to 3.0mm