الوصف

PCB design, layout, fabrication, assembly and function test ***2 placement IC precision: 0.4mm Lead-free technology SMT process Up to *2 layers mixed assembly technology used on communications Specialized in assembling boards for Network and communication, industry control Type of productions: SMT, though-hole BGA and COB Plastic injection Die-casting Sheet metal stamping X-ray and ICT test Within two hours to reply the inquiry such as E-mail, two to three working days to provide the quotations Professional engineering staff to provide technical support before and after sales With IPC**0 manufacturing and other international standards