الوصف

Our experience and expertise includes:

 Multilayer PCBs of up to *4 layers. If necessary, we will use microvia, blind via and/or buried via and backdrill technologies
 Flex and rigid-flex boards (single-layer and multi-layer)
  heavy copper PCBs and IMS PCBs
Depending on customer needs, we use the following design tools, among others: Mentor Pads, Mentor Xpedition, Altium Designer, Zuken Cadstar and Cadence Orcad/Allegro.

Our support for your project also includes electronics engineering and consultant services for RF and antenna design, signal integrity and high-speed design and simulation, and thermal and mechanical simulations.
 
The manufacturability and testability of your product can be ensured using the Design for Testability (DFT) and Design for Manufacturability methods (DFM).  The layout designer is always in contact with the customers electronics engineer to make sure that we get the requirements for the PCB right from the start.