2.Intelligent temperature wave heating, can achieve the solder/unsolder automatically.

3. Three-dimensional adjustable lamp body,use laser light, suitable for unsolderingany-angle components.

4. PID intelligent temperature control can avoid the IC damage due to the fast or uninterrupted warming up.

5. This machine has a super hot melt system, use infrared welding technology which is developed independently, heat is easy to pierce and distribute evenly, can suit for a variety of computer, notebook, play station’s  BGA components, especially in a Northbridge/ Southbridge chipset of computer.

6. Friendly human-machine operation interface, perfect LCD display, you can watch the whole repairing process very clearly.

7. Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T***0 to be easily bench positioned, transported or stored.

Technical parameters