الوصف

1, Apply Epistar Integrated Package High Power LED

A. Excellent heat dissipation
(1) Increase more than **0% heat dissipating area than other kinds package tech.
(2) Substrate made of pure copper material, with good Thermal Conductivity and low Thermal Resistance,
(3) Heat transfer medium use Thermal Conductive Silicone with high thermal conductivity, stable performance and strong heat transfer.

B. Using Fluorescent Powder / Phosphor with high conversion efficiency and Strict optical design ensure to get high Light Efficiency, balanced light and wide beam angle.

C. Low Light Attenuation / Luminous Decay
D. Long lifetime

2. Excellent Heat Dissipation Performance
(1) LEDs are placed on the high thermal conductivity aluminum plate, the LED junction’s temperature will be lower, which is able to accelerate the heat dissipation.
(2) Heat transfer medium use Thermal Conductive Silicone with high thermal conductivity, stable performance and strong heat transfer.
(3) Aluminum radiator with high thermal conductivity, designed of the high efficiency air convection cooling structure through the rigorous analysis and fluid dynamics simulation;
(4) The design of Semicircular aluminum plate is useful to the heat dissipation.

3. Isolated Constant Current Driver, driver efficiency up to *0%; IC imported from United States; constant current accuracy less than 2%; control components current precisely; over-current, overload, no-load protection.

4. Circuit Design and Safety Standard
A. Opt coupler isolation circuit design.
B. Isolation coil transformers, non-inductive.
C. Effectively resist surrounding electromagnetic environment effect, and inhibit the proliferation of electromagnetic energy to the surrounding environment.

D. Accord with the latest standards in LED Lighting industry;
EMC (EN****5, EN****7, EN********3 and EN********2)
LVD (EN****8, EN****1, EN****1 and EN****1
UL (UL***0, UL***3 and UL***0)
FCC (Part *8)