الوصف

protect the printed circuit board sawing boards


● moderate hardness, with a certain flexibility; ● moderate hardness, with a certain flexibility;
● flatness is good; good are desired flatness;
● The moisture absorption is not easy to deformation; ● absorb moisture are able to be deformed;
● thickness uniformity; ● good thickness uniformity;
● corrosive effect of contact with the copper foil; ● corrosive effect of contact with the copper foil;
● sawing processing section of good quality; ● sawing processing section of good quality;
● the role of sawing the material surface against damage protection; ● Protection against damage of sawing material surface effects;
● I expected drilling pad can be used for engraving and milling plate. ● I expected drilling pad can be used for engraving and milling plate.


● apply to printed circuit board sawing of all types of substrate protection and packaging. ● apply to printed circuit board sawing of all types of substrate protection and packaging.


Model Model


Thickness Thickness


Width Width


Length Length


Remarks Remarks

KF**0 KF**0


1.6mm 1.6mm
1.8mm 1.8mm
2.0mm 2.0mm


***1 mm, ***1 mm,


1 **5 mm, **5 mm, the


For special specifications sheet For special specifications sheet can be
Negotiated by both parties to supply Negotiated supply by supply and-demand


● Appearance: The surface of uniform color, smooth, without pits, bags and other surface defects, allowing irregular pigmentation; ● the Appearance: the surface of uniform color, smooth, without pits, bags and other surface defects, allowing irregular pigmentation;
● Thickness tolerance: ± 0.*0 mm ● Thickness tolerance.: ± 0.*0 mm
● The width deviation: ± 3.*0 mm ● of The width, deviation: ± 3.*0 mm,
● length deviation: ± 3.*0 mm ● length deviation: ± 3.*0 mm
● diagonal deviation: ± 5.*0 mm ● diagonal deviation: ± 5.*0 mm