thermal conductive pad

Product Description:
  No matter use what kind of cooling device , if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components , the cooling device will not be able to effectively reduce the heat of electronic components.
  This series of products have good thermal conductivity and filling properties, it can fill the air gap well between heating component and the heat dissipation module with its soft and elastic characteristics, the gap between the metal body and chassis ,  heat dissipation quickly, to promote the work efficiency of components and extend the service life of equipment.
 
Product feature:
1、Good thermal conductive performance.2、Soft and high compressibility, vibration shock absorber.3、Self-adhesive.4、Easy assemble.5、 Electrical insulation.6、Complies ROHS and UL environmental requirements.7、Provide a variety of thickness to choose.
Application area：
1、Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.2、Diode lights, power supply module, server, the hard disk.3、Plasma displays, LCD monitor, tablet computers, desktop computers, communications equipment, router.4、Memory module, video player, smart phone.