الوصف
products are mostly used for bonding heat dissipation
fins,microprocessors and other power consumption semiconductors.
This type of adhesive tape possesses ultimate bonding strength with
low thermal impedance, with which in effect can be able to replace
the method of lubricating grease and mechanical fixing.
Feature
》Thermal Conductivity 1.6W/mK.
》High bond strength to a variety of surfaces
Double sided pressure sensitive adhesive
tape.
》High performance, thermally conductive acrylic adhesive.
Application
》Mount heat sink onto BGA graphic
processor or drive processor.
》Mount heat spreader onto power converter PCB
or onto motor control PCB.
》High performance, thermally conductive acrylic adhesive .
》Can be used instead of heat cure adhesive,
screw mounting or clip mounting.
| بلد: |
China |
| نموذج رقم: |
-
|
| سعر فوب: |
(قابل للتفاوض)
أحصل على آخر سعر
|
| الموقع: |
- |
| سعر الحد الأدنى للطلب: |
- |
| الحد الأدني للطلب: |
- |
| تفاصيل التغليف: |
- |
| موعد التسليم: |
- |
| القدرة على التوريد: |
- |
| نوع الدفع: |
T/T |
| مجموعة المنتج : |
- |
