الوصف

• Layers: 1 to *8 layers
• Board finished thickness: 0.2 to 7.0mm
• Material: FR*4, CEM*1,CEM*3, high TG, FR4 halogen free, rogers
• Finished board size: *3 x *5 (maximum) ( **0 x **0mm )
• Drilled hole size: *-mil (0.**5mm) (minimum)
• Line width: *-mil (0.**5mm) (minimum)
• Line spacing: *-mil (0.**5mm) (minimum)
• Surface finish/treatment: HASL/HASL lead free, HAL, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating
• Copper thickness: 0.5 to 7.0oz
• Solder mask colors: green/yellow/black/white/red/blue
• Copper thickness in hole: >*5.0μm (>*-mil)
• Inner packing: vacuum packing/plastic bag
• Outer packing: standard carton packing
• Shape tolerance: ±0.*3
• Hole tolerance:
  • PTH: ±0.**6
  • NPTH: ±0.*5
• Certifications: UL-,SGS- and RoHS-approvals
• Special requirements: Buried and blind via + controlled impedance + BGA
• Profiling: punching, routing, V-CUT, beveling
• Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products