الوصف

PCB capability is as follows:
Product double side, multi-layer (4 to *0 layers), flex and rigid 
Base Material  FR*4, High Tg, Aluminum Base and Polyimide
Min. Core Thickness 0.***5" (0.**4 mm)
Types of Surface Finish HASL Lead free, Imm.Gold
Min. Hole Size (Drill) 0.**8" (0.*0 mm)
Via Hole PTH, Plugged Hole by resin or Solder mask
Min. Line Width & Spacing 4 mil / 4 mil (0.1 mm / 0.1 mm)
Min. Pitch 0.**6" (0.*5 mm)
Solder Mask UV curable, Photoimageable, Peelable Type
Warpage 0.*5% 
Impedance Control +/- *0%