الوصف

Laser perforation in general, possible to perforate by pulsed or enlarged focused laser beams are holes sizes from *****0 microns at density of holes of typically ****0 holes per cm, holes sequences **0,******0,**0 holes per second at a maximal of *6 punctured rows by laser distributed over the material web width with traditional systems or machines. Means in cigarette, tipping, plug wrap, filter, packaging, packs, tear tape, plastic and other material webs. With porosity levels from ****3,**0 C. U., normally in web widths from ******0 mm at web speeds of up to **0 m/min, depending on porosity and material consistency in relation to its ability to perforate.

IPM laser cluster material treatment and micro perforation technology

IPM laser cluster material treatment technology LPM*1 is patent granted DE***********7 and operates with quadruple Co2 carbon or other laser beam s up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to **0 individual laser output channels, perforation rows across the web material, combines automatic positioned laser perforation heads, focus setting, web speeds up to **0 m/min, web widths up to 2,**0 mm, up to 2,**0,**0 holes per second, jumbo roll-by-roll production, optical inline permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can archive ****1,**0 C.U.