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Zhuzhou Jiabang Refractory Metal Co., Ltd.

No.8 Shayuan Road,Xiangtan,Hunan,China China

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عروض بيع: 16

CuW Heat Sinks For IC Modules

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

Tungsten Copper Alloy Subcomponents Module Packaging Materials

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

CuW Heat Sink For Communication Module

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

Cu/Mocu/Cu High-Performance Heat Sink

Product Description: Cu/Mo*0Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo**-Cu alloy core

Copper Molybdenum Copper Encapsulation Materials, Electronic Packing Materials

Copper molybdenum copper encapsulation materials, electronic packing materials ...

Ceramic Packaging CPC Flanges, CPC Heat Sink

Product Description: Cu/Mo*0Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo**-Cu alloy core

CuW Heat Sinks For Microwave Tube

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

Mo-Cu Flanges

Product Description: It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailore

Customized W85Cu Tungsten Copper Alloy Electronic Packaging Mounting Base Plate

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

Electronic Packaging W90Cu Tungsten Copper Alloy Substrate

vW-Cumaterial is a composite of tungsten and copper, with both tungsten low expansion characteristics, but als

CuW RF Packaging Heat Sink

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

CPC Microelectronic Packages Body Materials

Product Description: Cu/Mo*0Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo**-Cu alloy core

Led Heat Dissipattion Cu, W Or CuW Substrate

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

CuW And CPC Flanges For Ceramic Air Cavity Packages

Product Description: Cu/Mo*0Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo**-Cu alloy core

MoCu Composite Heat-sink For Thermal Composite Packaging

Product Description: It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailore

Ceramics' HTCC CuW Heat Sink And Brazed Component

Product Description: It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of

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