communication-double-sided transfer

Description

Technology: Used material: FR4, CEM3, CEM1 Max layer: 8 layers Maximum board size: *0inch**4inch **0mm***0mm Minimum board thickness(outer): *2 mil 0.*0 mm 2 L *4 mil 0.*0 mm 4 L *8 mil 1.*0 mm 6 L *4 mil 1.*0 mm 8 L Minimum board thickness(inner): *2 mil 0.*0 mm Maximum aspect ratio: 8ï&frac*4;š1 8ï&frac*4;š1 Minimum SMD spacing: 4 mil 0.1mm Minimum finished hole size: 8 mil 0.2mm Layer count: **8 L Minimum trace space/width: 4mil 0.1mm Multilayer registration accuracy: ± 3 mil ±0.**5mm Accuracy of outline: ± 4 mil ±0.1m Maximum copper weight: 3OZ Control impendence: *0ï&frac*4;… Blind/buried via: Y Relative compliance: ISO***1:***0ï&frac*4;ŒISO/TS****9:***2ï&frac*4;ŒISO****1:***4ï&frac*4;ŒUL