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Exact maintain system (BGA repair station)

Exact maintain system (BGA repair station)

FOB Price

أحصل على آخر سعر

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Minimum Order

Place of Origin:

-

Price for Minimum Order:

-

Minimum Order Quantity:

1 Acre

Packaging Detail:

-

Delivery Time:

-

Supplying Ability:

10 Acre per Day

Payment Type:

-

الاتصال الآن
Beijing Torch S&T Co., Ltd

Beijing Torch S&T Co., Ltd

China

عضو مجاني

الشخص الذي يمكن الاتصال به Ms. Coco

Xiedao Road No.8, Chaoyang, Beijing

الاتصال الآن

Description

Exact maintain system BGA***0C
(BGA repair station)

Function introduction:

1.Adopt best heating material to control disassemble and weld for BGA.
 
2. Hot air and temperature can be adjusted, and generating high temperature rotate air.
 
3. Moving heating head, easy operation.
 
4. Temperature can be controlled independently on the top and in the bottom. Heating temperature can be displayed. 
 
5.Large power wind motor can cool rapidly to make PCB perfect. 
 
6. With different size hot air nozzles. It is easy to replace.
 
7. Adjusting PCB frame with anti-scald protection design.
 
8. Support frame in the BGA welding district, adjust support height to avoid going down of welding district.
 
9. *0 warm-up segments controlling, it can save 2 groups setting temperature profiles.
 
*0. With alarm and remind function after disassembly and weld. The circuit can cut off when short circuit. With super temperature
protection function.
 
*1. Hand vacuum absorb pen to absorb BGA, the suction can be adjusted. 
 
*2. It is suitable for lead and lead free welding.
 
Technical Parameters:

input voltage

AC**0V  *0/*0Hz  *0A

system power

***0W

pre-heating power in the bottom/highest temperature

***0W/**0℃

Pre-heating area in the bottom

**0***0MM

hot air power on the top/highest temperature

**0W/**0℃

temperature feedback

RTD sensor, close loop control

Flux in the hot air head

8,*6,*4 L/Minute can be chosen

Max chip size

*0mm×*0mm

Min chip size

1mm×1mm

Max chip weight

*5g

Max PCB size

**0mm×**0mm

Max thickness of PCB

3mm

Suitable chip

BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF，BCC

Dimension

**5×**0 ×**8mm

Please feel free to ask for more information, we will answer you with a great pleasure.  

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إلى:

Ms. Coco < Beijing Torch S&T Co., Ltd >

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