pcb board

Description

SPECIFICATION OF PCB  Country of Origin:China (mainland)  Vendor to be UL recognized to minimum category of *4V0  Fabricated in accordance with IPC-A***0, latest version unless otherwise specified in attached specification.  All patterns according to Customer PCB Artwork/Film/Gerber File.  Material: FR*4  We would provide a copy of UL materials certificate.  This is a Single Layer Double Layer 4Layer Other  Weight of Copper: 1 oz per sq .ft(Base Material)for Outer Layers. Finish to be 2oz per ***** oz per *****(Base Material)for Inner Layers.  Finished Board thickness shall be(Tolerance is ±*0%):0.8mm 1.0mm 1.2mm 1.6mm Other  Finishing according to IPC-TM***0(2.2.*3)latest version.  Via Method: PTH NPTH Blind Via between layer  Carbon TH No crack, no unblocked holes  Sliver TH-Less than *0% of the front view area of the silver through hole unblocked.  PCB must be identified with MFR’S approval logo, type designation week and year(WWYY) OF MFR and Customer P/  MFR’s UL Logo&indicated location According to PCB Drawing of Gerber data  Date code location: Print on Top/Bottom Side Silkscreen Layer  Etch on Top/Bottom Side Copper Layer.  Customer Part No.&Silkscreen Layers According to PCB Drawing or Gerber data indicated location.  All PCB will be electrical tested before shipment  Other Test and Reliability standard refer to IPC-A***0(latest version)PCB Class1 Class2 Class 3  As per ion-contamination test results.(IPC-TM***0 Test Method2.3.*5)  Finishing: HAL ENTEK Pre-flux Gold Flash Gold Plating Immersion Tin Immersion Silver Immersion gold  Min. hole size: *2mil or mm(Remark: The minimum hole size are for drill bit size)  Legend Silkscreen: Top or Bottom side  Legend marking do not allow printed on soldering pad and must keep clearance *0 mil min, leave to the soldering pad  Silkscreen color: White Yellow Black  We will provide specification