Description

NO. ITEM INDEX *1 Surface treatment HAL(lead free), Immersion Gold, OSP *2 Layer Single-sided, double-sided, multilayer and special structure layer *3 Max size ***0mm***0mm *4 PCB thickness 0.**3.3mm *5 Copper foil thickness H 1 2 3 4 5 6 *0(OZ) *6 Insulating layer thickness *0 *5 **0 **5 **0 micron *7 Metal base type AluminumïÂ&frac*4;?FerrumïÂ&frac*4;?CopperïÂ&frac*4;?Stainless steel *8 Metal base thickness 0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm) *9 Shaping Die Punching, CNC Route, CNC V-Cut *0 Testing **0% Compute Short/Open Circuit Test *1 The Minimum Hole Diameter single-sided 0.8mm, PTH 0.3mm *2 The Minimum Pad Size 1.2mm *3 The Minimum PTH Distance 2.0mm *4 The Minimum Line Width 0.1mm *5 The Minimum Increase of Solder Mask 0.*5mm *6 The Minimum Pad *0um *7 Solder Mask Color green, white, black, red, yellow *8 The Minimum Letter Width 0.*5mm *9 The Minimum Letter Height 0.8mm *0 Letter Color white, black, blue, yellow, red