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الشخص الذي يمكن الاتصال به Ms. Sara
Xixiang, Shenzhen, Guangdong
PCBA Asssembly (Lead free, RohS complied) 1. Surface Mouted Technology (SMT) 2. Through Hole Technology (THT) 3. Profiling: Punching, Routing, V-cut, Beveling 4. Material based: CME1, CME3, FR4, High TG FR4, Halogen-free FR4, Aluminium, Ceramic, PTFE(F4B, F4BK), Rogers(***3, ***0, ***0), Taconic, Arlon(*5N, *5N), etc. 5. Min.hole ring: 0.**5mm 6. Hole position/Tolerance: ±0.*5mm / ±0.**6mm 7. Special requirements: Buried & Blind vias + Controlled impedance + BGA 8. Certificate: UL, ISO***1
