Description

1. Can repair 1mm size chip.
2. Windows XP system, multi-language interface, operation easy with functional software.
3. Auto-operation. Heatiing suction and sucker working are controlled by computer.
4. Welding, mounting and countpoint positions all can be progamm and memory, parameter limitless.
5. Three independent heating zones, suitable lead-free process, no nozzle.
6. Qualified heating material at the bottom of BGA, which make hi-temperature with breeze that is superior to infra heating board only.
7. Special pallet for different PCB board.
8. Panasonic PLC, Hi temperature control precision.
9. CCD visual system available, surveying the process of BGA tin ball melting and reflow.