Description

Used for different specifications from 5x5mmïÂ&frac*2;ï¿&frac*2;*8x*8mm including tectangle BGA reballing and realize quick, accurate placement. Specially suitable for various BGA reballing need. Features: Designed for various BGA reballing, flexible, convenient and high efficientãï¿&frac*2;ï¿&frac*2; Visual process control assure accuracy in sphere placement. Satisfy rectangle and square componentsâï¿&frac*2;ï¿&frac*2; BGA at the same time The maximum thickness of the components can be up to 5.5mm. Used for 5x5mmïÂ&frac*2;ï¿&frac*2;*8x*8mm BGA Could design and change tooling or custom as special specification(abnormity, beyond specification). Basic Configuration BGA reballing fixture: 1 Stencil fix frame: 2 Suitable for *5Ãï¿&frac*2;*5mmïÂ&frac*2;ï¿&frac*2;*8Ãï¿&frac*2;*8mm and *8Ãï¿&frac*2;*8mmïÂ&frac*2;ï¿&frac*2;*8Ãï¿&frac*2;*8mm components Components holder: 2 Suitable for *5Ãï¿&frac*2;*5mmïÂ&frac*2;ï¿&frac*2; Components seat rings: 3 Φ*2ïÂ&frac*4;ï¿&frac*2;Φ*8ïÂ&frac*4;ï¿&frac*2;Φ*0mm Options: Metal packaging case Top frame Stencil fix frame Brush Socket head wrench Spatulas Solder spheres Solder braid