Printed Circuit Board

Description

PCB Specification：

Size                     **0 x **0mm
Material               FR4
No of Layers      4
Thickness          1.6
Finish                  HASL (Lead free) (RoHS)
Copper Weight  1.0oz       
Solder mask       Green,LPI
Legend               White
Panel Form        2*2
Profilling              V-CUT,CNC
Packing               Vacuum plastic and cartons
Application         Communication

The design does not contain Blind Vias 
The design does not contain Buried Vias  
The design does not contain holes smaller than 0.*5mm (0.**0inches)

The design conforms to the following design rules
(For multilayer boards)
Minimum track thickness 5 mil (0.*3mm)
Minimum track clearance 5 mil (0.*3mm)
(For single and double sided boards)
Minimum track thickness 6 mil (0.*5mm)
Minimum track clearance 6 mil (0.*5mm)

Layer Description
(Note: Inner layers are counted from the top downwards)

Top Silk Screen Overlay       Designname.GTO
Top Solder Mask                   Designname.GTS
Top Copper                             Designname.GTL
Inner Copper 1                       Designname.G1
Inner Copper 2                       Designname.G2
Bottom Copper                       Designname.GBL
Bottom Solder Mask              Designname.GBS
Bottom Silk Screen                Designname.GBO
NC Drill File                             Designname.GDD
Outline                                      Designname.GM1