Description

Tin cream is the most important connection material to assemble technology of modern PCB printing and SMT. Lead free products have SnCu，SnAgCu，SnAg，SnAgCuCe，SnBi，SnAgBi etc.Tin lead have Sn*3/Pb*7 ；Sn*2/Pb*6/Ag2.  They can be classed into high temperature solder paste, low temperature paste, inactive paste, middle reactive solder paste, reactive paste paste, organic solvent washes type, water washes type and free washes solder paste etc.

Specification as following:

1. Alloy solder powder is the main component which is from *5 percent to *0 percent.
2. The size of alloy powder have No2, No3 and No4 etc.
 3. The shape of alloy powder have two kinds: round type and olive type.
4. The content of flux is from *0 percent to *5 percent.
5. Solder paste can be stored for 6 months in low temperature between 5 degrees and *0 degrees. Once you open to use it, you must use up within one week.
6. **0gram is palced into a bottle, 5kg or *0 kg into a canton,