Description
Applicable to various R&D fields that sputter deposition of
metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips,
new materials, nanomaterials, and sample preparations, etc.
Special Features
RF or DC magnetron sputter for multipurpose R&D.
RF to DC power supply easily changed without hardware change.
Deposition available for various materials of metals, carbon
materials, metal oxides and metal nitrides, etc.
Small space needed for installation.
Efficient deposition through easy operation.
High performance to low cost.
Target shutter, view port shutter and chamber liners installed.
Ar gas introduced between cathode shield and target for high
sputter yield.
Reactive sputtering also available.
Specifications
Target size: 2in to 3in
System control: PLC-based touch panel
Substrate holder size: normally up to 3in wafer
Substrate heating: basically not heated or water-cooled (optionally
heated up to **0oC)
Bias plasma applied to substrate holder (optional)
Target to substrate distance: *0 to **0mm controllable
Sputter power supply: **0W RF power supply(*3.*6MHz) with matching
circuit (DC power optional)
Process gas: Ar, O2 (N2 optional)
Vacuum gauge: low and high vacuum gauges
Base pressure: <5.0E*6Torr <br /> Pumping system of TMP
(*1 l/s)+rotary oil pump(**0 l/min) (dry pump is optionally
available)
Water: <*0oC, 2kg/cm2, *0l/min <br /> Compressed air:
5kg/cm2
Weight: **0kg
Dimension: **1mm(W) x **8mm(D) x **9mm(H)
