Description
lead free solder bga reflow oven T***2
1. INFRARED IC HEATER T**2 works automatically by micro-computer
control. Can satisfy a dissimilarity SMDBAG Soldering a request.
Whole soldering process to complete automatically, easy to use,
Adoption fast infrared radiation and circulation the wind for heat,
So the temperature is very Accurate and even.
The faintness controls a technique and can see the drawer type
workbench, Make whole soldering process at you of the under
surveillance automatic completed; Can soldering the most smart
small part.
Adopted a high and dependable design, make what you use gratifying
and rest assured.
2. Products Features
(1). Have big infrared soldering max area:
Soldering area to reach effectively: **0× **5mm, Increase the usage
scope of this machine consumedly, economical investment.
(2) Many temperature wave choice for you.
Memory eight kinds of temperature parameter waves can be provided
as choice, and establish to move heating and cool off function
compulsory; Whole soldering process to complete automatically, easy
to use.
(3) Special heat up and temperature equalization with all
design.
Output the power reaches to a **0 W, Adoption fast infrared
radiation and circulation the wind for heat, so the temperature is
very Accurate and even, Whole soldering process to complete
automatically for you choice temperature parameter waves.
(4). Humanized science and technology exquisite article.
Firm of external appearance, can see of operation, amity of person
machine operation interface, the perfect temperature wave project,
from start to eventually body science and technology now is
originally;
The agile physical volume and weight, let you economize a great
deal of money, the set noodles type places mode, can let you own
larger space; Simple operating instructions, let you a see can
use.
(5) Perfect function choice.
Return soldering, drying, heat preservation, finalize the design,
fast cool off etc. Can use Can soldering the most smart small part
example CHIP, SOP, PLCC, QFP, BGA etc; Can used to the gum of the
product solid turn, the circuit board is hot aging, the PCB plank
maintains to wait various works. Be applicable to each kind of
business enterprise, company extensively develop and the small
batch quantity produce a demand.
(6)Technic parameter
Soldering max area: **0× **5 mm
Size: *1× *9× *7cm
Packing size: *6× *3× *6 cm
Rated power: **0W
Process Period: 1~8 min
Supply: AC**0V/*2Hz
Net weight: 6.2kg
Gross weight: 7.5kg