Description

1.OEM service 
2.Factory price
3.Certificate:UL,ISO,TS****9,Rohs ;
4.Paypal, T/T,West Union
5.MOQ:1pcs

Our capacity:

• Layer: 1 to *8 layers
• Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free, Rogers
• Board thickness: 0.*1mm to 7.0mm
• Copper thickness: 0.5 OZ to 7.0 OZ
• Copper thickness in hole: >*5.0 um (>1mil)
• Size:

- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)

• Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
• Solder Mask Color: Green/Yellow/Black/White/Red/Blue
• Tolerance

- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5

• PCB Packing

- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing

• Certificate: UL, ISO ***1, ISO ****1
• Special requirements: Buried and blind vias+controlled impedance +BGA
• Profiling: Punching, Routing, V-CUT, Beveling
• Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

• Layer: 1 to *8 layers
• Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free, Rogers
• Board thickness: 0.*1mm to 7.0mm
• Copper thickness: 0.5 OZ to 7.0 OZ
• Copper thickness in hole: >*5.0 um (>1mil)
• Size:

- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)

• Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
• Solder Mask Color: Green/Yellow/Black/White/Red/Blue
• Tolerance

- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5

• PCB Packing

- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing

• Certificate: UL, ISO ***1, ISO ****1
• Special requirements: Buried and blind vias+controlled impedance +BGA
• Profiling: Punching, Routing, V-CUT, Beveling
• Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

• Layer: 1 to *8 layers
• Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free, Rogers
• Board thickness: 0.*1mm to 7.0mm
• Copper thickness: 0.5 OZ to 7.0 OZ
• Copper thickness in hole: >*5.0 um (>1mil)
• Size:

- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)

• Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
• Solder Mask Color: Green/Yellow/Black/White/Red/Blue
• Tolerance

- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5

• PCB Packing

- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing

• Certificate: UL, ISO ***1, ISO ****1
• Special requirements: Buried and blind vias+controlled impedance +BGA
• Profiling: Punching, Routing, V-CUT, Beveling
• Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.