Description

Technical Characteristics (Main configuration)

Diameter of sliced ingots, mm: up to **0mm

Length of sliced ingots, mm: up to **0

Weight of sliced ingots, maximum, kg:*1.5

Wire winding speed, m/s: 0.3 - *5

Transversal approach speed,mm/min.:0.*7 - 1

Number of wafers from one cycle of cutting (thickness of 0.7mm), pieces:**9

Duration of one cycle with a sapphire ingot of *0.8mm in diameter and **0mm in length (resulting in **9 wafers), hours: 2 - 2.5

Parallelism of wafers with a diameter of *0.8mm, micro meters: *0 - *0

Weight of the device, kg: ***0

Watch industry configuration:

One cycle of slicing allows to obtain up to **0 wafers* of *0.8mm in diameter and 0.7mm thick in 2 - 2.5 hours.

*for use in the watch making industry