Description

product name: ceramic substrate,ceramic wafer,ceramic circuit board
specifications:
material:Al2O3,*6%                                
SiO2,0.6%
SrCO3,1.0%
AL4(Si4O*0)OH6,1.5%
other,0.9%                
sintering temperature: ***0 deg c
Coeffecient of heat conductitiy:0.4Cal.Cm.S.℃        
flatness: ***0 HV5
sizes:
length is *2mm
width is *0mm
thickness is 0.8mm
applications:
to be used for ceramic substrate,ceramic wafer,ceramic circuit board, ozone generating ceramic chips, etc.