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Resin Bond Diamond Dicing Blades for Cutting Crystal, Optiacal Glass and Semiconductor

Resin Bond Diamond Dicing Blades for Cutting Crystal, Optiacal Glass and Semiconductor

1 ~ 100 / Piece ( Negotiable )

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Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

1 Piece

Packaging Detail:

customized

Delivery Time:

3-5 days

Supplying Ability:

100000 Piece per Week

Payment Type:

T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal

الاتصال الآن
عضو مجاني

الشخص الذي يمكن الاتصال به chenkai

HangHai Road, ZhengZhou , China, Zhengzhou, Henan

الاتصال الآن

Description

Features

Taking advantage of its excellent elasticity, the ability of this bond to cut has been maxiumized. They are suitable for processing of hard-to-cut materials.

Good elasticity and good self-sharpening

Superor production process, realized dicing of hard, brittle and composite materials.

Combination of a variety of models and high-cost-effective.

cutting effectSelf-sharpness, high cutting ability and efficiency

Excellent bond elasticity, improve cutting quality.

Six important paraments for choosing resin bond blade:

{C}1.      {C}Diamond type

{C}2.      {C}Diamond grit

{C}3.      {C}Bond type

{C}4.      {C}Diamond concentration

{C}5.      {C}Blade outside diameter (mm)

{C}6.      {C}Blade thickness (mm)

Application

Glass, quartz, crystals, sapphire, hard alloy, tungthen carbide, semiconductor package materials(QFN, BGA, etc.), lithium niobate, ceramics, etc.

Send a direct inquiry to this supplier

إلى:

chenkai < Henan Yinwang Trade Co. , Ltd >

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