Description
~I. Function
Surface mount backflow soldering machine
II. Technical parameter
1. In welding process, PCB is in static state/ The surface
components should be in correct position, and avoid not be
soldering.
2. Soldering zone use far infrared ray heat, and high temperature
motor force to be heated.
3. Equip with nitrogen protection connector, and use nitrogen to
make protection.
4. Soldering zone use fuzzy control technology, you can only set 3
units of technical parameter, then you can control the whole
temperature curve, and you can follow temperature change, blue
backlight LCD display.
5. It use **0×**0mm dot matrix high resolution LCD display, the
dimension of LCD is **3mm Dot matrix high resolution LCD*0mm.
6. The solding machine can be connected to PC, and use backflow
curve to record save software.
7. The welding machine has 4 ways temperature sensor interface,
sensor head is PT**0, it can correct welding temperature curve
through backflow analysis
8. Dimension: **0×**0×**0mm
9. Peak power: 3.5KW
