Description

GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor. Comparing with Bergquist gap pad ***0S*5, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ ***0S*5.
Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ ***0S*5; the thermal resistance is only 0.*6℃in2/W, its just one third of BQ ***0S*5. Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ***0S*5.
For the electrical property, the dielectric breakdown voltage is *6KV, its 3 times greater than BQ ***0S*5s. this will ensure the stability of performance of devices.
The material yields extremely soft characteristics while maintaining elasticity and conformability. Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components. The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing  the overall thermal performance.
GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure.

Features
Ultra conformable,gel-like modulus
Designed for low-stress applications
Conformable, low hardness
Applications
Telecommunications
ComputerBetween any heat-generating  semiconductor and a heat sink